Inventor
WAKAO MIYUKI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “WAKAO MIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
19 patentsUS6225704B1May 1, 2001
Flip-chip type semiconductor device
SHINETSU CHEMICAL CO55 citations95
US6512031B1Jan 28, 2003
Epoxy resin composition, laminate film using the same, and semiconductor device
SHINETSU CHEMICAL CO47 citations92
US6429238B1Aug 6, 2002
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
SHINETSU CHEMICAL CO28 citations92
US6376923B1Apr 23, 2002
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
SHINETSU CHEMICAL CO38 citations92
US6294271B1Sep 25, 2001
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
SHINETSU CHEMICAL CO37 citations92
US6210811B1Apr 3, 2001
Epoxy resin composition, laminate film using the same, and semiconductor device
SHINETSU CHEMICAL CO25 citations92
US5336786AAug 9, 1994
Organic silicon compounds
SHINETSU CHEMICAL CO24 citations92
US6383659B1May 7, 2002
Epoxy resin composition, laminate film using the same, and semiconductor device
SHINETSU CHEMICAL CO14 citations83
US9660157B2May 23, 2017
Addition-curable silicone resin composition and die attach material for optical semiconductor device
SHINETSU CHEMICAL CO4 citations73
US6506822B2Jan 14, 2003
Epoxy resin composition
SHINETSU CHEMICAL CO12 citations73
US5473091ADec 5, 1995
Quaternary phosphorus compounds and their preparation
SHINETSU CHEMICAL CO4 citations63
US7985806B2Jul 26, 2011
Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same
SHINETSU CHEMICAL CO5 citations62
US6709756B2Mar 23, 2004
Optical device-related adhesive and optical device
SHINETSU CHEMICAL CO4 citations61
US9147818B2Sep 29, 2015
Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device
SHINETSU CHEMICAL CO1 citations52
US9963542B2May 8, 2018
Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same
SHINETSU CHEMICAL CO0 citations48
US7910638B2Mar 22, 2011
Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device
SHINETSU CHEMICAL CO1 citations48
US10308803B2Jun 4, 2019
Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof
SHINETSU CHEMICAL CO0 citations40
US9777107B2Oct 3, 2017
Silicone-modified epoxy resin and composition and cured article thereof
SHINETSU CHEMICAL CO0 citations40
US9944760B2Apr 17, 2018
Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof
SHINETSU CHEMICAL CO0 citations38