Inventor

SHIOBARA TOSHIO

JP194 patents

⚠️ This page may combine multiple inventors who share the name “SHIOBARA TOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIOBARA TOSHIO

SHINETSU CHEMICAL CO

Light-emitting semiconductor potting composition and light-emitting semiconductor device

Epoxy resin composition and semiconductor device encapsulated therewith

Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith

Flip-chip type semiconductor device

Thermosetting resin compositions

Epoxy resin-based curable compositions

Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet

Epoxy-silicone mixed resin composition and light-emitting semiconductor device

Method of fabricating a flip chip mold injected package

Epoxy resin compositions and semiconductor devices encapsulated therewith

Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith

Epoxy resin composition and semiconductor devices encapsulated therewith

Resin-encapsulated semiconductor devices

Epoxy resin composition

Epoxy resin composition

Epoxy resin composition for encapsulation of semiconductor devices

Method for the preparation of an organohydrogenpolysiloxane as a product of a partial addition reaction

Conductive resin composition

Semiconductor encapsulating epoxy resin composition and semiconductor device

Epoxy resin composition, laminate film using the same, and semiconductor device

Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith

Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device

Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device

Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device

Flip-chip type semiconductor device underfill

Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device

Epoxy resin composition, laminate film using the same, and semiconductor device

Semiconductor encapsulating epoxy resin composition and semiconductor device

Semiconductor encapsulating epoxy resin composition and semiconductor device

Flame retardant epoxy resin compositions

Liquid epoxy resin composition for ball grid array package

Epoxy resin composition

Naphthalene and or biphenyl skeleton containing epoxy resin composition

Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith

Silicone rubber compositions

Organic silicon compounds

High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions

Heat-curable silicone resin compositions

Flip chip encapsulating compositions and semiconductor devices encapsulated therewith

Semiconductor encapsulating epoxy resin compositions

Semiconductor sealing liquid epoxy resin compositions

Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor device

Silicone lens and silicone resin composition for molding lens

Phosphor-filled curable silicone resin composition and cured product thereof

MITSUBISHI ELECTRIC CORP

Inorganic filler, epoxy resin composition, and semiconductor device

Epoxy resin compositions and semiconductor devices encapsulated therewith

SHIN ESTU CHEMICAL CO LTD

Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device

NIPPON DENSO CO

Epoxy resin composition and cured product thereof

SONY CORP

Epoxy resin compositions and premolded semiconductor packages

TATSUMORI LTD

Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith