Inventor

COOK KEITH R

US13 patents

⚠️ This page may combine multiple inventors who share the name “COOK KEITH R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

8 patents

US7282433B2Oct 16, 2007

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

MICRON TECHNOLOGY INC21 citations92

US7939948B2May 10, 2011

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

MICRON TECHNOLOGY INC7 citations84

US8012847B2Sep 6, 2011

Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry

MICRON TECHNOLOGY INC15 citations82

US9472518B2Oct 18, 2016

Semiconductor structures including carrier wafers and methods of using such semiconductor structures

MICRON TECHNOLOGY INC4 citations72

US7387940B2Jun 17, 2008

Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry

MICRON TECHNOLOGY INC4 citations72

US8349699B2Jan 8, 2013

Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry

MICRON TECHNOLOGY INC3 citations62

US7528064B2May 5, 2009

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

MICRON TECHNOLOGY INC0 citations52

US10128142B2Nov 13, 2018

Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures

MICRON TECHNOLOGY INC0 citations51

GEN MOTORS CORP

4 patents

US4398704AAug 16, 1983

ITT AUTOMOTIVE ELECTRICAL SYST

1 patent

US5616182AApr 1, 1997

Method and apparatus for wiping a windshield

ITT AUTOMOTIVE ELECTRICAL SYST2 citations62

COOK KEITH R

MICRON TECHNOLOGY INC

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry

Semiconductor structures including carrier wafers and methods of using such semiconductor structures

Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry

Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures

GEN MOTORS CORP

Vehicle pneumatic suspension system with dead band adjustment

Clutch for power door lock actuator

Motor reversing circuit for vehicle windshield wiper

Power window control with tape drive tension release

ITT AUTOMOTIVE ELECTRICAL SYST

Method and apparatus for wiping a windshield