Inventor

PHEE JAE-HYUN

KR7 patents

⚠️ This page may combine multiple inventors who share the name “PHEE JAE-HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HO-JIN

2 patents

US8637989B2Jan 28, 2014

Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes

LEE HO-JIN9 citations83

US8492902B2Jul 23, 2013

Multi-layer TSV insulation and methods of fabricating the same

LEE HO-JIN8 citations83

CHOI JU-IL

2 patents

US8778776B2Jul 15, 2014

Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same

CHOI JU-IL0 citations50

US8564102B2Oct 22, 2013

Semiconductor device having through silicon via (TSV)

CHOI JU-IL0 citations50

PHEE JAE-HYUN

1 patent

US8575760B2Nov 5, 2013

Semiconductor devices having electrodes

PHEE JAE-HYUN21 citations85

JO CHAJEA

1 patent

US8129840B2Mar 6, 2012

Semiconductor package and methods of manufacturing the same

JO CHAJEA8 citations76

JEONG SE-YOUNG

1 patent

US8586477B2Nov 19, 2013

Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package

JEONG SE-YOUNG0 citations45