Inventor
BECKENBAUGH WILLIAM
US3 patents
Patents
3 patentsUS5429292AJul 4, 1995
Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
MOTOROLA INC27 citations91
US5086966AFeb 11, 1992
Palladium-coated solder ball
MOTOROLA INC41 citations90
US5389160AFeb 14, 1995
Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
MOTOROLA INC14 citations72