Inventor

LAI NGUK CHIN

MY3 patents

Patents

3 patents

US7674653B2Mar 9, 2010

Die offset die to bonding

SPANSION LLC2 citations57

US7750481B2Jul 6, 2010

Die offset die to die bonding

SPANSION LLC0 citations46

US7554204B2Jun 30, 2009

Die offset die to die bonding

SPANSION LLC0 citations46