Inventor

WONG KWET NAM

MY5 patents

⚠️ This page may combine multiple inventors who share the name “WONG KWET NAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SPANSION LLC

4 patents

US7674653B2Mar 9, 2010

Die offset die to bonding

SPANSION LLC2 citations57

US7759171B2Jul 20, 2010

Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package

SPANSION LLC4 citations53

US7750481B2Jul 6, 2010

Die offset die to die bonding

SPANSION LLC0 citations46

US7554204B2Jun 30, 2009

Die offset die to die bonding

SPANSION LLC0 citations46

HUSSIN PAKHORUDIN

1 patent

US8546936B2Oct 1, 2013

Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package

HUSSIN PAKHORUDIN0 citations36