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Inventor
KEE CHENG SIM
MY
4 patents
⚠️ This page may combine multiple inventors who share the name “KEE CHENG SIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SPANSION LLC
3 patents
US7674653B2
Mar 9, 2010
Die offset die to bonding
SPANSION LLC
2 citations
57
US7750481B2
Jul 6, 2010
Die offset die to die bonding
SPANSION LLC
0 citations
46
US7554204B2
Jun 30, 2009
Die offset die to die bonding
SPANSION LLC
0 citations
46
FOONG YIN LYE
1 patent
US8586413B2
Nov 19, 2013
Multi-chip module having a support structure and method of manufacture
FOONG YIN LYE
2 citations
42