P

Inventor

SEOK SEUNG-DAE

KR6 patents
⚠️ This page may combine multiple inventors who share the name “SEOK SEUNG-DAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMES CO LTD

3 patents
US11600515B2Mar 7, 2023

Die pickup module and die bonding apparatus including the same

SEMES CO LTD6 citations68
US9620476B2Apr 11, 2017

Bonding head and die bonding apparatus having the same

SEMES CO LTD6 citations62
US12090642B2Sep 17, 2024

Die pickup module and die bonding apparatus including the same

SEMES CO LTD0 citations56

SAMSUNG ELECTRONICS CO LTD

2 patents
US10058952B2Aug 28, 2018

Bonding stage and bonding apparatus comprising the same

SAMSUNG ELECTRONICS CO LTD2 citations70
US9508577B2Nov 29, 2016

Semiconductor manufacturing apparatuses comprising bonding heads

SAMSUNG ELECTRONICS CO LTD1 citations46

SEOK SEUNG-DAE

1 patent
US9431365B2Aug 30, 2016

Apparatus for bonding semiconductor chips

SEOK SEUNG-DAE4 citations64