Inventor

OZCAN AHMET S

US76 patents

⚠️ This page may combine multiple inventors who share the name “OZCAN AHMET S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OZCAN AHMET S

IBM

Raised trench metal semiconductor alloy formation

Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements

Self-aligned liner formed on metal semiconductor alloy contacts

Inducing channel strain via encapsulated silicide formation

Semiconductor device with reduced junction leakage and an associated method of forming such a semiconductor device

Method for forming a protection layer over metal semiconductor contact and structure formed thereon

Liner-free tungsten contact

Surface cleaning using sacrificial getter layer

Low temperature ion implantation for improved silicide contacts

Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements

Low resistance source-drain contacts using high temperature silicides

Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements

Thermally stable salicide formation for salicide first contacts

Forming thermally stable salicide for salicide first contacts

Low resistance source-drain contacts using high temperature silicides

Low resistance source-drain contacts using high temperature silicides

Forming thermally stable salicide for salicide first contacts

Thermally stable salicide formation for salicide first contacts

Fully depleted silicon-on-insulator device formation

Method for forming metal semiconductor alloys in contact holes and trenches

High memory bandwidth neuromorphic computing system

Channel silicon germanium formation method

Low resistance source-drain contacts using high temperature silicides

Low parasitic capacitance and resistance finFET device

Structure and method to form a thermally stable silicide in narrow dimension gate stacks

Structure and method to form dual silicide e-fuse

Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements

Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements

Computational method for temporal pooling and correlation

Self-adjusting threshold for synaptic activity in neural networks

Method to improve semiconductor surfaces and polishing

Wafer-scale power delivery

Low parasitic capacitance and resistance finFET device

Fully depleted silicon-on-insulator device formation

Wafer-scale power delivery

Material removal process for self-aligned contacts

Fully depleted silicon-on-insulator device formation

Material removal process for self-aligned contacts

Material removal process for self-aligned contacts

Method for forming metal semiconductor alloys in contact holes and trenches

Diffusion-controlled oxygen depletion of semiconductor contact interface

GLOBALFOUNDRIES INC

Oxide mediated epitaxial nickel disilicide alloy contact formation

Oxide mediated epitaxial nickel disilicide alloy contact formation

Contacts to semiconductor substrate and methods of forming same

Contacts to semiconductor substrate and methods of forming same

LAVOIE CHRISTIAN

Metal-semiconductor intermixed regions

Liner-free tungsten contact

Method to control metal semiconductor micro-structure

DE SOUZA JOEL P

Strain preserving ion implantation methods

SAMSUNG ELECTRONICS CO LTD

Metallic synapses for neuromorphic and evolvable hardware