Inventor
MCCANN AARON
US7 patents
Patents
7 patentsUS12266589B2Apr 1, 2025
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US12057369B2Aug 6, 2024
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US11854935B2Dec 26, 2023
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US11832419B2Nov 28, 2023
Full package vapor chamber with IHS
INTEL CORP0 citations59
US11769753B2Sep 26, 2023
Thermally-optimized tunable stack in cavity package-on-package
INTEL CORP0 citations57
US11869824B2Jan 9, 2024
Thermal interface structures for integrated circuit packages
INTEL CORP0 citations44
US11679407B2Jun 20, 2023
Liquid metal thermal interface material application
INTEL CORP0 citations44