Inventor
NEAL NICHOLAS
US19 patents
Patents
19 patentsUS12261150B2Mar 25, 2025
Mold shelf package design and process flow for advanced package architectures
INTEL CORP1 citations74
US12087731B2Sep 10, 2024
No mold shelf package design and process flow for advanced package architectures
INTEL CORP1 citations72
US11901333B2Feb 13, 2024
No mold shelf package design and process flow for advanced package architectures
INTEL CORP1 citations72
US10553548B2Feb 4, 2020
Methods of forming multi-chip package structures
INTEL CORP6 citations71
US12009271B2Jun 11, 2024
Protruding SN substrate features for epoxy flow control
INTEL CORP2 citations70
US11640929B2May 2, 2023
Thermal management solutions for cored substrates
INTEL CORP2 citations68
US11942393B2Mar 26, 2024
Substrate with thermal insulation
INTEL CORP0 citations62
US11901262B2Feb 13, 2024
Cooling solution including microchannel arrays and methods of forming the same
INTEL CORP0 citations62
US11804418B2Oct 31, 2023
Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions
INTEL CORP1 citations62
US12362250B2Jul 15, 2025
Protruding SN substrate features for epoxy flow control
INTEL CORP0 citations59
US12266589B2Apr 1, 2025
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US12057369B2Aug 6, 2024
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US11854935B2Dec 26, 2023
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US11832419B2Nov 28, 2023
Full package vapor chamber with IHS
INTEL CORP0 citations59
US11776864B2Oct 3, 2023
Corner guard for improved electroplated first level interconnect bump height range
INTEL CORP0 citations59
US11594463B2Feb 28, 2023
Substrate thermal layer for heat spreader connection
INTEL CORP0 citations59
US11587843B2Feb 21, 2023
Thermal bump networks for integrated circuit device assemblies
INTEL CORP0 citations58
US10461011B2Oct 29, 2019
Microelectronics package with an integrated heat spreader having indentations
INTEL CORP0 citations50
US12334453B2Jun 17, 2025
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance
INTEL CORP0 citations49