Inventor

TSENG MING HUNG

TW93 patents

⚠️ This page may combine multiple inventors who share the name “TSENG MING HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

42 patents

US10269773B1Apr 23, 2019

Semiconductor packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD45 citations98

US9761522B2Sep 12, 2017

Wireless charging package with chip integrated in coil center

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations92

US11244906B2Feb 8, 2022

Semiconductor structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US10790244B2Sep 29, 2020

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84

US10784223B2Sep 22, 2020

Elongated bump structures in package structure

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US10497646B2Dec 3, 2019

Dual-mode wireless charging device

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US10163780B2Dec 25, 2018

Wireless charging package with chip integrated in coil center

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84

US10115685B2Oct 30, 2018

Method of manufacturing a semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84

US10074472B2Sep 11, 2018

InFO coil on metal plate with slot

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84

US9953936B2Apr 24, 2018

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US9406629B2Aug 2, 2016

Semiconductor package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83

US11848288B2Dec 19, 2023

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11682655B2Jun 20, 2023

Semiconductor packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US11664325B2May 30, 2023

Semiconductor structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US11502039B2Nov 15, 2022

Semiconductor package and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11410932B2Aug 9, 2022

Semiconductor device and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73

US11251119B2Feb 15, 2022

Package structure, package-on-package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US11133269B2Sep 28, 2021

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11075176B2Jul 27, 2021

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10971477B2Apr 6, 2021

Semiconductor packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10950519B2Mar 16, 2021

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10847304B2Nov 24, 2020

InFO coil on metal plate with slot

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10784203B2Sep 22, 2020

Semiconductor package and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73

US10763229B2Sep 1, 2020

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US10720388B2Jul 21, 2020

Wireless charging package with chip integrated in coil center

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10530175B2Jan 7, 2020

Hexagonal semiconductor package structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10304614B2May 28, 2019

Stacked coil for wireless charging structure on InFO package

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10128203B2Nov 13, 2018

Fan-out package structure, antenna system and associated method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US9991218B2Jun 5, 2018

Connector structures of integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US9748216B2Aug 29, 2017

Apparatus and method for a component package

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US9741589B2Aug 22, 2017

Substrate pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US9053990B2Jun 9, 2015

Bump interconnection techniques

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73

US11227837B2Jan 18, 2022

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72

US10037973B2Jul 31, 2018

Method for manufacturing semiconductor package structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72

US12261092B2Mar 25, 2025

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64

US12362283B2Jul 15, 2025

Semiconductor device and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12322696B2Jun 3, 2025

Dual-mode wireless charging device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12288729B2Apr 29, 2025

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12255184B2Mar 18, 2025

Semiconductor packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12159839B2Dec 3, 2024

Semiconductor packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11996227B2May 28, 2024

Hexagonal semiconductor package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11935804B2Mar 19, 2024

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

TAIWAN SEMICONDUCTOR MFG

5 patents

US8889484B2Nov 18, 2014

Apparatus and method for a component package

TAIWAN SEMICONDUCTOR MFG16 citations93

US9117825B2Aug 25, 2015

Substrate pad structure

TAIWAN SEMICONDUCTOR MFG12 citations92

US9355933B2May 31, 2016

Cooling channels in 3DIC stacks

TAIWAN SEMICONDUCTOR MFG9 citations84

US9093440B2Jul 28, 2015

Connector structures of integrated circuits

TAIWAN SEMICONDUCTOR MFG6 citations84

US7180227B2Feb 20, 2007

Piezoelectric o-ring transducer

TAIWAN SEMICONDUCTOR MFG9 citations65

PAN KUO LUNG

1 patent

US9059107B2Jun 16, 2015

Packaging methods and packaged devices

PAN KUO LUNG21 citations89

LIU TZUAN-HORNG

1 patent

US8193639B2Jun 5, 2012

Dummy metal design for packaging structures

LIU TZUAN-HORNG8 citations83

CHEN YU-REN

1 patent

US8916969B2Dec 23, 2014

Semiconductor devices, packaging methods and structures

CHEN YU-REN14 citations82

Showing the top 50 of 93 patents by PatentIndex Score.