Inventor
ANGYAL MATTHEW
US6 patents
⚠️ This page may combine multiple inventors who share the name “ANGYAL MATTHEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
4 patentsUS7009280B2Mar 7, 2006
Low-k interlevel dielectric layer (ILD)
IBM15 citations80
US10796949B2Oct 6, 2020
Airgap vias in electrical interconnects
IBM2 citations71
US8350359B2Jan 8, 2013
Semiconductor device using an aluminum interconnect to form through-silicon vias
IBM4 citations62
US11011415B2May 18, 2021
Airgap vias in electrical interconnects
IBM0 citations60