Inventor
MATSUSHIMA HIRONORI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “MATSUSHIMA HIRONORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
10 patentsUS5656863AAug 12, 1997
Resin seal semiconductor package
MITSUBISHI ELECTRIC CORP183 citations98
US6232652B1May 15, 2001
Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof
MITSUBISHI ELECTRIC CORP59 citations96
US6191493B1Feb 20, 2001
Resin seal semiconductor package and manufacturing method of the same
MITSUBISHI ELECTRIC CORP67 citations95
US6515360B2Feb 4, 2003
Packaged semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP29 citations92
US6384485B1May 7, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP25 citations92
US5753973AMay 19, 1998
Resin seal semiconductor package
MITSUBISHI ELECTRIC CORP28 citations92
US6184586B1Feb 6, 2001
Semiconductor device including a ball grid array
MITSUBISHI ELECTRIC CORP18 citations84
US5920770AJul 6, 1999
Resin seal semiconductor package and manufacturing method of the same
MITSUBISHI ELECTRIC CORP13 citations81
US6399422B1Jun 4, 2002
Radiating plate structure and method for manufacturing semiconductor devices using the same structure
MITSUBISHI ELECTRIC CORP4 citations60
US7725847B2May 25, 2010
Wiring design support apparatus for bond wire of semiconductor devices
MITSUBISHI ELECTRIC CORP1 citations47