Inventor
LIM SEE CHIAN
SG6 patents
⚠️ This page may combine multiple inventors who share the name “LIM SEE CHIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
3 patentsUS9559039B2Jan 31, 2017
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
STATS CHIPPAC LTD2 citations72
US9240331B2Jan 19, 2016
Semiconductor device and method of making bumpless flipchip interconnect structures
STATS CHIPPAC LTD4 citations71
US9627338B2Apr 18, 2017
Semiconductor device and method of forming ultra high density embedded semiconductor die package
STATS CHIPPAC LTD1 citations58
JCET SEMICONDUCTOR SHAOXING CO LTD
2 patentsUS12148677B2Nov 19, 2024
Semiconductor device and method of forming ultra high density embedded semiconductor die package
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58
US11227809B2Jan 18, 2022
Semiconductor device and method of forming ultra high density embedded semiconductor die package
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58