P

Inventor

FANG CHING MENG

SG8 patents
⚠️ This page may combine multiple inventors who share the name “FANG CHING MENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DELPHI TECH INC

3 patents
US7616448B2Nov 10, 2009

Wrap-around overmold for electronic assembly

DELPHI TECH INC43 citations90
US7455552B1Nov 25, 2008

Overmolded electronic assembly with metal seal ring

DELPHI TECH INC22 citations89
US7462077B2Dec 9, 2008

Overmolded electronic assembly

DELPHI TECH INC5 citations59

JCET SEMICONDUCTOR SHAOXING CO LTD

2 patents
US12148677B2Nov 19, 2024

Semiconductor device and method of forming ultra high density embedded semiconductor die package

JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58
US11227809B2Jan 18, 2022

Semiconductor device and method of forming ultra high density embedded semiconductor die package

JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58

AGERE SYST GUARDIAN CORP

1 patent
US6319450B1Nov 20, 2001

Encapsulated circuit using vented mold

AGERE SYST GUARDIAN CORP26 citations89

STATS CHIPPAC PTE LTD

1 patent
US12469791B2Nov 11, 2025

Semiconductor device and method of stacking hybrid substrates with embedded electric components

STATS CHIPPAC PTE LTD0 citations62

STATS CHIPPAC LTD

1 patent
US9627338B2Apr 18, 2017

Semiconductor device and method of forming ultra high density embedded semiconductor die package

STATS CHIPPAC LTD1 citations58