Inventor
SHIH WEN-LIN
TW7 patents
Patents
7 patentsUS9576929B1Feb 21, 2017
Multi-strike process for bonding
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US11456256B2Sep 27, 2022
Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12532725B2Jan 20, 2026
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125794B2Oct 22, 2024
Semiconductor device and manufacturing method of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002761B2Jun 4, 2024
Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11101195B2Aug 24, 2021
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10068868B2Sep 4, 2018
Multi-strike process for bonding packages and the packages thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51