Inventor
NA SONG
KR2 patents
Patents
2 patentsUS9257413B2Feb 9, 2016
Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same
SK HYNIX INC4 citations69
US11501981B2Nov 15, 2022
Methods for fabricating semiconductor packages by using a mold press with an upper chase and a lower chase
SK HYNIX INC0 citations39