Inventor
HYUN YOUNG HOON
KR3 patents
Patents
3 patentsUS12057366B2Aug 6, 2024
Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations71
US11600545B2Mar 7, 2023
Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11069592B2Jul 20, 2021
Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure
SAMSUNG ELECTRONICS CO LTD3 citations71