Inventor
CHUNG JIN-SUNG
KR3 patents
Patents
3 patentsUS7256502B2Aug 14, 2007
Metal interconnections for semiconductor devices including a buffer layer on a trench sidewall
SAMSUNG ELECTRONICS CO LTD15 citations86
US6787448B2Sep 7, 2004
Methods for forming metal interconnections for semiconductor devices using a buffer layer on a trench sidewall
SAMSUNG ELECTRONICS CO LTD14 citations78
US8865508B2Oct 21, 2014
Method of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations39