Inventor

KUO CHIN-WEI

TW60 patents

⚠️ This page may combine multiple inventors who share the name “KUO CHIN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUO CHIN-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Methods and apparatus for transmission lines in packages

Semiconductor structure

Methods and apparatus for transmission lines in packages

Method of forming semiconductor package transmission lines with micro-bump lines

Semiconductor structure

Differential MOSCAP device

Transformer with bypass capacitor

Filter and capacitor using redistribution layer and micro bump layer

Compact vertical inductors extending in vertical planes

Integrated capacitor

Semiconductor device with patterned ground shielding

Semiconductor device with patterned ground shielding

Semiconductor device with patterned ground shielding

Filter and capacitor using redistribution layer and micro bump layer

Filter and capacitor using redistribution layer and micro bump layer

Compact vertical inductors extending in vertical planes

Compact vertical inductors extending in vertical planes

Filter and capacitor using redistribution layer and micro bump layer

Slot-shielded coplanar strip-line compatible with CMOS processes

De-embedding on-wafer devices

YEN HSIAO-TSUNG

Integrated antenna structure on separate semiconductor die

Transformer with bypass capacitor

Structure and method for a fishbone differential capacitor

Through-substrate via waveguides

3D inductor and transformer

Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps

Apparatus and methods for de-embedding through substrate vias

System and method for modeling through silicon via

Structure and method for a high-K transformer with capacitive coupling

De-embedding on-wafer devices

Antenna using through-silicon via

TAIWAN SEMICONDUCTOR MFG

Helical spiral inductor between stacking die

Methods and apparatus for transmission lines in packages

Methods and apparatus for inductors and transformers in packages

Integrated circuits and methods of forming the same

Inductor with magnetic material

Antenna using through-silicon via

3-D inductor and transformer

Integrated capacitor

Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps

Transmission line formed adjacent seal ring

CHEN CHIA-CHUNG

Four-terminal gate-controlled LVBJTs

Gated-varactors

Gated-varactors

LIN YU-LING

3D transmission lines for semiconductors

Slot-shielded coplanar strip-line compatible with CMOS processes

KAIKUTEK INC

Radar system with self-interference cancelling function

Oscillator

YEN HSIAO TSUNG

Semiconductor structure

CHO HSIU-YING

Transmission line characterization using EM calibration