Inventor
DEPPISCH CARL
US16 patents
⚠️ This page may combine multiple inventors who share the name “DEPPISCH CARL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
11 patentsUS7955900B2Jun 7, 2011
Coated thermal interface in integrated circuit die
INTEL CORP20 citations91
US7821126B2Oct 26, 2010
Heat sink with preattached thermal interface material and method of making same
INTEL CORP11 citations84
US7164585B2Jan 16, 2007
Thermal interface apparatus, systems, and methods
INTEL CORP11 citations83
US7439617B2Oct 21, 2008
Capillary underflow integral heat spreader
INTEL CORP10 citations80
US7081669B2Jul 25, 2006
Device and system for heat spreader with controlled thermal expansion
INTEL CORP10 citations74
US7416922B2Aug 26, 2008
Heat sink with preattached thermal interface material and method of making same
INTEL CORP7 citations73
US8030757B2Oct 4, 2011
Forming a semiconductor package including a thermal interface material
INTEL CORP4 citations62
US7494041B2Feb 24, 2009
In-situ alloyed solders, articles made thereby, and processes of making same
INTEL CORP2 citations60
US11916003B2Feb 27, 2024
Varied ball ball-grid-array (BGA) packages
INTEL CORP0 citations58
US7816250B2Oct 19, 2010
Composite solder TIM for electronic package
INTEL CORP0 citations50
US7727815B2Jun 1, 2010
Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
INTEL CORP0 citations47