Inventor

HSU CHUN-LEI

TW4 patents

⚠️ This page may combine multiple inventors who share the name “HSU CHUN-LEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU CHUN-LEI

2 patents

US8981559B2Mar 17, 2015

Package on package devices and methods of packaging semiconductor dies

HSU CHUN-LEI50 citations95

US8993431B2Mar 31, 2015

Method of fabricating bump structure

HSU CHUN-LEI5 citations71

TAIWAN SEMICONDUCTOR MFG

2 patents

US9397080B2Jul 19, 2016

Package on package devices and methods of packaging semiconductor dies

TAIWAN SEMICONDUCTOR MFG6 citations83

US9257401B2Feb 9, 2016

Method of fabricating bump structure and bump structure

TAIWAN SEMICONDUCTOR MFG9 citations83