Inventor
MORIYAMA HIRONOBU
JP11 patents
⚠️ This page may combine multiple inventors who share the name “MORIYAMA HIRONOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DEXERIALS CORP
7 patentsUS9653371B2May 16, 2017
Underfill material and method for manufacturing semiconductor device using the same
DEXERIALS CORP4 citations70
US9202755B2Dec 1, 2015
Circuit connecting material and semiconductor device manufacturing method using same
DEXERIALS CORP4 citations70
US9741598B2Aug 22, 2017
Protective tape and method for manufacturing a semiconductor device using the same
DEXERIALS CORP3 citations68
US10312125B2Jun 4, 2019
Protective tape and method for manufacturing semiconductor device using the same
DEXERIALS CORP1 citations56
US9957411B2May 1, 2018
Underfill material and method for manufacturing semiconductor device using the same
DEXERIALS CORP1 citations50
US10483148B2Nov 19, 2019
Protective tape and method for manufacturing semiconductor device
DEXERIALS CORP0 citations49
US10062625B2Aug 28, 2018
Underfill material and method for manufacturing semiconductor device using the same
DEXERIALS CORP0 citations49