Inventor
MORISHIGE YUKIO
JP32 patents
⚠️ This page may combine multiple inventors who share the name “MORISHIGE YUKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
15 patentsUS7473866B2Jan 6, 2009
Laser processing apparatus
DISCO CORP124 citations96
US9878397B2Jan 30, 2018
SiC wafer producing method
DISCO CORP50 citations94
US7601616B2Oct 13, 2009
Wafer laser processing method
DISCO CORP15 citations84
US7232741B2Jun 19, 2007
Wafer dividing method
DISCO CORP13 citations84
US7179722B2Feb 20, 2007
Wafer dividing method
DISCO CORP20 citations84
US7585751B2Sep 8, 2009
Wafer dividing method using laser beam with an annular spot
DISCO CORP14 citations83
US7557904B2Jul 7, 2009
Wafer holding mechanism
DISCO CORP12 citations83
US7405376B2Jul 29, 2008
Processing apparatus using laser beam
DISCO CORP7 citations74
US9475152B2Oct 25, 2016
Laser processing method and laser processing apparatus
DISCO CORP4 citations72
US7713845B2May 11, 2010
Laser processing method for wafer
DISCO CORP2 citations63
US7553777B2Jun 30, 2009
Silicon wafer laser processing method and laser beam processing machine
DISCO CORP2 citations63
US7332415B2Feb 19, 2008
Silicon wafer dividing method and apparatus
DISCO CORP6 citations63
US7642485B2Jan 5, 2010
Laser beam processing machine
DISCO CORP2 citations62
US7449396B2Nov 11, 2008
Wafer dividing method
DISCO CORP4 citations62
US7582541B2Sep 1, 2009
Wafer laser processing method
DISCO CORP1 citations52
NEC CORP
12 patentsUS6136096AOct 24, 2000
Method and apparatus for correcting defects in photomask
NEC CORP18 citations92
US5343271AAug 30, 1994
Exposure apparatus for drawing patterns on substrates
NEC CORP51 citations92
US4873413AOct 10, 1989
Method and apparatus for writing a line on a patterned substrate
NEC CORP38 citations92
US4711790ADec 8, 1987
Optical CVD method with a strong optical intensity used during an initial period and device therefor
NEC CORP33 citations92
US5628926AMay 13, 1997
Method of forming via holes in a insulation film and method of cutting the insulation film
NEC CORP24 citations89
US4976930ADec 11, 1990
Method and apparatus for inducing photochemical reaction
NEC CORP24 citations89
US6678304B2Jan 13, 2004
Laser correction method and apparatus
NEC CORP10 citations74
US6333130B1Dec 25, 2001
Method and apparatus for correcting defects in photomask
NEC CORP11 citations74
US6496255B2Dec 17, 2002
Measurement of crystal face orientation
NEC CORP5 citations63
US6733848B2May 11, 2004
Thin film forming equipment and method
NEC CORP2 citations60
US6336975B1Jan 8, 2002
Thin film forming equipment and method
NEC CORP4 citations60
US6664524B2Dec 16, 2003
Focusing method
NEC CORP0 citations40
LASERFRONT TECHNOLOGIES INC
4 patentsUS6879605B2Apr 12, 2005
Method and apparatus for performing pattern defect repair using Q-switched mode-locked pulse laser
LASERFRONT TECHNOLOGIES INC70 citations92
US6926801B2Aug 9, 2005
Laser machining method and apparatus
LASERFRONT TECHNOLOGIES INC9 citations74
US6890387B2May 10, 2005
Method and device for correcting pattern film on a semiconductor substrate
LASERFRONT TECHNOLOGIES INC5 citations54
US7166167B2Jan 23, 2007
Laser CVD device and laser CVD method
LASERFRONT TECHNOLOGIES INC0 citations52