Inventor
HAN MINSOO
KR5 patents
Patents
5 patentsUS10950470B2Mar 16, 2021
Substrate bonding apparatus and bonding method using the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11581188B2Feb 14, 2023
Substrate bonding apparatus
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US11443965B2Sep 13, 2022
Wafer to wafer bonding apparatuses
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US12112970B2Oct 8, 2024
Substrate transfer apparatus
SAMSUNG ELECTRONICS CO LTD0 citations52
US11805580B2Oct 31, 2023
LED driving device and lighting device including the same
SAMSUNG ELECTRONICS CO LTD0 citations41