Inventor
CHUNG JOON HYUNG
US5 patents
Patents
5 patentsUS10318694B2Jun 11, 2019
Adaptive multi-tier power distribution grids for integrated circuits
QUALCOMM INC5 citations79
US9520358B2Dec 13, 2016
Via structure for optimizing signal porosity
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US10956645B2Mar 23, 2021
Adaptive multi-tier power distribution grids for integrated circuits
QUALCOMM INC3 citations68
US10078358B2Sep 18, 2018
System and method for reducing power delivery network complexity through local power multiplexers
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US9620452B2Apr 11, 2017
Via structure for optimizing signal porosity
QUALCOMM INC0 citations46