Inventor

BIAR JIN-CHYUAN

TW3 patents

⚠️ This page may combine multiple inventors who share the name “BIAR JIN-CHYUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED TEST CT INC

1 patent

US6190943B1Feb 20, 2001

Chip scale packaging method

UNITED TEST CT INC26 citations86

APACK TECHNOLOGIES INC

1 patent

US6221689B1Apr 24, 2001

Method for improving the reliability of underfill process for a chip

APACK TECHNOLOGIES INC10 citations71

BIAR JIN-CHYUAN

1 patent

US7737452B2Jun 15, 2010

Light-emitting element package and light source apparatus using the same

BIAR JIN-CHYUAN4 citations49