Inventor

LEE JUNGCHUL

KR21 patents

⚠️ This page may combine multiple inventors who share the name “LEE JUNGCHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE JUNGCHUL

SAMSUNG ELECTRONICS CO LTD

Apparatuses for bonding semiconductor chips

Semiconductor manufacturing apparatus and operating method thereof

Semiconductor manufacturing apparatus and operating method thereof

Laser beam delivery apparatus for extreme ultra violet light source

Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them

Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them

Stealth dicing laser device

Polarization measuring device and method of fabricating semiconductor device using the same

Apparatuses for bonding semiconductor chips

Wafer inspection apparatus and system including the same

Semiconductor equipment monitoring apparatus, and semiconductor equipment including the semiconductor equipment monitoring apparatus

Level sensor and substrate processing apparatus including the same

Optical assembly for alignment inspection, optical apparatus including the same, die bonding system and die bonding method using the same

Light source and extreme ultraviolet light source system using the same

Hyperspectral imaging (HSI) apparatus and inspection apparatus including the same

KING WILLIAM P

Device for calorimetric measurement

UNIV ILLINOIS

Microcantilever heater-thermometer with integrated temperature-compensated strain sensor

HWANG YISUNG

Apparatuses for bonding semiconductor chips

SON SUNGMIN

Apparatus and method for measuring buoyant mass and deformability of single cells

UNIV SOGANG RES FOUNDATION

Micro-fluid measuring apparatus with an actuator and a tuning fork

SAMSUNG SDI CO LTD

Method of forming electrode, electrode manufactured therefrom and solar cell