P

Inventor

SHEN HONG

CN173 patents
⚠️ This page may combine multiple inventors who share the name “SHEN HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INVENSAS CORP

19 patents
US10446456B2Oct 15, 2019

Integrated circuits protected by substrates with cavities, and methods of manufacture

INVENSAS CORP172 citations99
US9741620B2Aug 22, 2017

Structures and methods for reliable packages

INVENSAS CORP186 citations99
US9165793B1Oct 20, 2015

Making electrical components in handle wafers of integrated circuit packages

INVENSAS CORP141 citations99
US11056390B2Jul 6, 2021

Structures and methods for reliable packages

INVENSAS CORP38 citations98
US9824974B2Nov 21, 2017

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

INVENSAS CORP54 citations98
US9666559B2May 30, 2017

Multichip modules and methods of fabrication

INVENSAS CORP70 citations98
US9478504B1Oct 25, 2016

Microelectronic assemblies with cavities, and methods of fabrication

INVENSAS CORP64 citations98
US9252127B1Feb 2, 2016

Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture

INVENSAS CORP53 citations98
US11114408B2Sep 7, 2021

System and method for providing 3D wafer assembly with known-good-dies

INVENSAS CORP20 citations94
US9397038B1Jul 19, 2016

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

INVENSAS CORP27 citations94
US9324626B2Apr 26, 2016

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

INVENSAS CORP30 citations94
US9437536B1Sep 6, 2016

Reversed build-up substrate for 2.5D

INVENSAS CORP12 citations93
US10163833B2Dec 25, 2018

Multichip modules and methods of fabrication

INVENSAS CORP10 citations84
US9899281B2Feb 20, 2018

Integrated circuits protected by substrates with cavities, and methods of manufacture

INVENSAS CORP4 citations84
US9691696B2Jun 27, 2017

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

INVENSAS CORP10 citations84
US9548273B2Jan 17, 2017

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

INVENSAS CORP10 citations84
US9508638B2Nov 29, 2016

Making electrical components in handle wafers of integrated circuit packages

INVENSAS CORP4 citations84
US9412806B2Aug 9, 2016

Making multilayer 3D capacitors using arrays of upstanding rods or ridges

INVENSAS CORP12 citations84
US9402312B2Jul 26, 2016

Circuit assemblies with multiple interposer substrates, and methods of fabrication

INVENSAS CORP11 citations84

SIEMENS MEDICAL SOLUTIONS

6 patents

SKYWORKS SOLUTIONS INC

5 patents

HOFFMANN LA ROCHE

5 patents

SHEN HONG

3 patents

SUGEN INC

2 patents

SIEMENS CORP RES INC

2 patents

HONG LIN

2 patents

SIEMENS MEDICALS SOLUTIONS USA

1 patent

AGOURON PHARMA

1 patent

CUI JINGRONG JEAN

1 patent

CORNELL RES FOUNDATION INC

1 patent

KIRALY ATILLA PETER

1 patent

PFIZER

1 patent

Showing the top 50 of 173 patents by PatentIndex Score.