Inventor
SHEN HONG
CN173 patents
⚠️ This page may combine multiple inventors who share the name “SHEN HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENSAS CORP
19 patentsUS10446456B2Oct 15, 2019
Integrated circuits protected by substrates with cavities, and methods of manufacture
INVENSAS CORP172 citations99
US9741620B2Aug 22, 2017
Structures and methods for reliable packages
INVENSAS CORP186 citations99
US9165793B1Oct 20, 2015
Making electrical components in handle wafers of integrated circuit packages
INVENSAS CORP141 citations99
US11056390B2Jul 6, 2021
Structures and methods for reliable packages
INVENSAS CORP38 citations98
US9824974B2Nov 21, 2017
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
INVENSAS CORP54 citations98
US9666559B2May 30, 2017
Multichip modules and methods of fabrication
INVENSAS CORP70 citations98
US9478504B1Oct 25, 2016
Microelectronic assemblies with cavities, and methods of fabrication
INVENSAS CORP64 citations98
US9252127B1Feb 2, 2016
Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture
INVENSAS CORP53 citations98
US11114408B2Sep 7, 2021
System and method for providing 3D wafer assembly with known-good-dies
INVENSAS CORP20 citations94
US9397038B1Jul 19, 2016
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
INVENSAS CORP27 citations94
US9324626B2Apr 26, 2016
Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication
INVENSAS CORP30 citations94
US9437536B1Sep 6, 2016
Reversed build-up substrate for 2.5D
INVENSAS CORP12 citations93
US10163833B2Dec 25, 2018
Multichip modules and methods of fabrication
INVENSAS CORP10 citations84
US9899281B2Feb 20, 2018
Integrated circuits protected by substrates with cavities, and methods of manufacture
INVENSAS CORP4 citations84
US9691696B2Jun 27, 2017
Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication
INVENSAS CORP10 citations84
US9548273B2Jan 17, 2017
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
INVENSAS CORP10 citations84
US9508638B2Nov 29, 2016
Making electrical components in handle wafers of integrated circuit packages
INVENSAS CORP4 citations84
US9412806B2Aug 9, 2016
Making multilayer 3D capacitors using arrays of upstanding rods or ridges
INVENSAS CORP12 citations84
US9402312B2Jul 26, 2016
Circuit assemblies with multiple interposer substrates, and methods of fabrication
INVENSAS CORP11 citations84
SIEMENS MEDICAL SOLUTIONS
6 patentsUS7702153B2Apr 20, 2010
Systems and methods for segmenting object of interest from medical image
SIEMENS MEDICAL SOLUTIONS57 citations98
US7627159B2Dec 1, 2009
2D visualization for rib analysis
SIEMENS MEDICAL SOLUTIONS11 citations84
US7620226B2Nov 17, 2009
Semi-local active contour for a faint region detection in knee CT images
SIEMENS MEDICAL SOLUTIONS12 citations84
US7602965B2Oct 13, 2009
Object detection using cross-section analysis
SIEMENS MEDICAL SOLUTIONS17 citations84
US7369693B2May 6, 2008
Thoracic cage coordinate system for recording pathologies in lung CT volume data
SIEMENS MEDICAL SOLUTIONS14 citations84
US7301535B2Nov 27, 2007
3D summary display for reporting of organ tumors
SIEMENS MEDICAL SOLUTIONS14 citations84
SKYWORKS SOLUTIONS INC
5 patentsUS9041472B2May 26, 2015
Power amplifier modules including related systems, devices, and methods
SKYWORKS SOLUTIONS INC70 citations98
US9755592B2Sep 5, 2017
Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods
SKYWORKS SOLUTIONS INC12 citations91
US12143077B2Nov 12, 2024
Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via
SKYWORKS SOLUTIONS INC3 citations84
US9231068B2Jan 5, 2016
Methods of stress balancing in gallium arsenide wafer processing
SKYWORKS SOLUTIONS INC5 citations84
US10629468B2Apr 21, 2020
Device packaging using a recyclable carrier substrate
SKYWORKS SOLUTIONS INC6 citations82
HOFFMANN LA ROCHE
5 patentsUS9447086B2Sep 20, 2016
6-amino acid heteroaryldihydropyrimidines for the treatment and prophylaxis of hepatitis B virus infection
HOFFMANN LA ROCHE34 citations93
US9233978B2Jan 12, 2016
6-fused heteroaryldihydropyrimidines for the treatment and prophylaxis of hepatitis B virus infection
HOFFMANN LA ROCHE18 citations91
US10428069B2Oct 1, 2019
6-fused heteroaryldihydropyrimidines for the treatment and prophylaxis of hepatitis B virus infection
HOFFMANN LA ROCHE6 citations83
US10081627B2Sep 25, 2018
6-fused heteroaryldihydropyrimidines for the treatment and prophylaxis of hepatitis B virus infection
HOFFMANN LA ROCHE9 citations83
US10596173B2Mar 24, 2020
Combination therapy of an HBV capsid assembly inhibitor and an interferon
HOFFMANN LA ROCHE10 citations82
SHEN HONG
3 patentsUS8415805B2Apr 9, 2013
Etched wafers and methods of forming the same
SHEN HONG20 citations92
US9093506B2Jul 28, 2015
Process for fabricating gallium arsenide devices with copper contact layer
SHEN HONG6 citations84
US8165376B2Apr 24, 2012
System and method for automatic detection of rib metastasis in computed tomography volume
SHEN HONG7 citations83
SUGEN INC
2 patentsSIEMENS CORP RES INC
2 patentsHONG LIN
2 patentsSIEMENS MEDICALS SOLUTIONS USA
1 patentAGOURON PHARMA
1 patentCUI JINGRONG JEAN
1 patentCORNELL RES FOUNDATION INC
1 patentKIRALY ATILLA PETER
1 patentPFIZER
1 patentShowing the top 50 of 173 patents by PatentIndex Score.