Inventor
BOYKO CHRISTINA M
US12 patents
Patents
12 patentsUS6931726B2Aug 23, 2005
Method of making and interconnect structure
IBM91 citations98
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Process for manufacturing a printed wiring board
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Interconnect structure for joining a chip to a circuit card
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Process for manufacturing a printed wiring board
IBM66 citations94
US5450290ASep 12, 1995
Printed circuit board with aligned connections and method of making same
IBM153 citations94
US5953623ASep 14, 1999
Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection
IBM43 citations92
US5571593ANov 5, 1996
Via fill compositions for direct attach of devices and methods for applying same
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Epoxy composition of increased thermal conductivity and use thereof
IBM23 citations86
US6660945B2Dec 9, 2003
Interconnect structure and method of making same
IBM9 citations74
US5374338ADec 20, 1994
Selective electroetch of copper and other metals
IBM10 citations71
US6776852B2Aug 17, 2004
Process of removing holefill residue from a metallic surface of an electronic substrate
IBM0 citations52
US5472735ADec 5, 1995
Method for forming electrical connection to the inner layers of a multilayer circuit board
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