Inventor

MARTINEZ LIANE

CA9 patents

⚠️ This page may combine multiple inventors who share the name “MARTINEZ LIANE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

3 patents

US12499300B1Dec 16, 2025

Systems and methods for generating a floorplan and bump placement for a package design

ADVANCED MICRO DEVICES INC0 citations53

US7847568B2Dec 7, 2010

Multi-site probe

ADVANCED MICRO DEVICES INC2 citations52

US11960813B2Apr 16, 2024

Automatic redistribution layer via generation

ADVANCED MICRO DEVICES INC0 citations47

MARTINEZ LIANE

2 patents

US8637983B2Jan 28, 2014

Face-to-face (F2F) hybrid structure for an integrated circuit

MARTINEZ LIANE6 citations68

US9607935B2Mar 28, 2017

Semiconductor chip package with undermount passive devices

MARTINEZ LIANE2 citations67

LEUNG ANDREW

1 patent

US8298945B2Oct 30, 2012

Method of manufacturing substrates having asymmetric buildup layers

LEUNG ANDREW9 citations81

SHI XIAO LING

1 patent

US9209106B2Dec 8, 2015

Thermal management circuit board for stacked semiconductor chip device

SHI XIAO LING10 citations75

ATI TECHNOLOGIES ULC

1 patent

US8012874B2Sep 6, 2011

Semiconductor chip substrate with multi-capacitor footprint

ATI TECHNOLOGIES ULC5 citations58

MCLELLAN NEIL R

1 patent

US8564122B2Oct 22, 2013

Circuit board component shim structure

MCLELLAN NEIL R0 citations48