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Inventor
OH HWA SUB
KR
2 patents
⚠️ This page may combine multiple inventors who share the name “OH HWA SUB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
1 patent
US10643919B2
May 5, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD
7 citations
79
OH HWA-SUB
1 patent
US8399801B2
Mar 19, 2013
Method of manufacturing printed circuit board
OH HWA-SUB
3 citations
53