Inventor

GOESELE ULRICH M

US6 patents

⚠️ This page may combine multiple inventors who share the name “GOESELE ULRICH M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIV DUKE

2 patents

US4962879AOct 16, 1990

Method for bubble-free bonding of silicon wafers

UNIV DUKE107 citations95

US4883215ANov 28, 1989

Method for bubble-free bonding of silicon wafers

UNIV DUKE110 citations95

GOESELE ULRICH M

2 patents

US5024723AJun 18, 1991

Method of producing a thin silicon on insulator layer by wafer bonding and chemical thinning

GOESELE ULRICH M131 citations93

US5206523AApr 27, 1993

Microporous crystalline silicon of increased band-gap for semiconductor applications

GOESELE ULRICH M39 citations88

MAX PLANCK SOC

1 patent

US6150239ANov 21, 2000

Method for the transfer of thin layers monocrystalline material onto a desirable substrate

MAX PLANCK SOC263 citations96

MAX PLANCK SOCIETY

1 patent

US5877070AMar 2, 1999

Method for the transfer of thin layers of monocrystalline material to a desirable substrate

MAX PLANCK SOCIETY899 citations92