Inventor
LAKHERA NISHANT
US15 patents
⚠️ This page may combine multiple inventors who share the name “LAKHERA NISHANT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
8 patentsUS12415305B2Sep 16, 2025
Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes
NXP USA INC0 citations61
US11787097B2Oct 17, 2023
Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes
NXP USA INC0 citations61
US11189557B2Nov 30, 2021
Hybrid package
NXP USA INC0 citations59
US11270972B2Mar 8, 2022
Package with conductive underfill ground plane
NXP USA INC0 citations49
US10217698B2Feb 26, 2019
Die attachment for packaged semiconductor device
NXP USA INC0 citations49
US11908784B2Feb 20, 2024
Packaged semiconductor device assembly
NXP USA INC0 citations46
US10431534B2Oct 1, 2019
Package with support structure
NXP USA INC0 citations45
US10211184B2Feb 19, 2019
Apparatus and methods for multi-die packaging
NXP USA INC0 citations39
FREESCALE SEMICONDUCTOR INC
7 patentsUS9953904B1Apr 24, 2018
Electronic component package with heatsink and multiple electronic components
FREESCALE SEMICONDUCTOR INC9 citations79
US9559077B2Jan 31, 2017
Die attachment for packaged semiconductor device
FREESCALE SEMICONDUCTOR INC0 citations49
US9508632B1Nov 29, 2016
Apparatus and methods for stackable packaging
FREESCALE SEMICONDUCTOR INC1 citations49
US9691637B2Jun 27, 2017
Method for packaging an integrated circuit device with stress buffer
FREESCALE SEMICONDUCTOR INC0 citations48
US9947614B2Apr 17, 2018
Packaged semiconductor device having bent leads and method for forming
FREESCALE SEMICONDUCTOR INC0 citations46
US10147645B2Dec 4, 2018
Wafer level chip scale package with encapsulant
FREESCALE SEMICONDUCTOR INC0 citations37
US9978614B2May 22, 2018
Structure and method to minimize warpage of packaged semiconductor devices
FREESCALE SEMICONDUCTOR INC0 citations36