Inventor
SCANLAN CHRISTOPHER M
US59 patents
⚠️ This page may combine multiple inventors who share the name “SCANLAN CHRISTOPHER M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DECA TECHNOLOGIES INC
25 patentsUS9040316B1May 26, 2015
Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
DECA TECHNOLOGIES INC40 citations98
US9887103B2Feb 6, 2018
Semiconductor device and method of adaptive patterning for panelized packaging
DECA TECHNOLOGIES INC40 citations94
US9831170B2Nov 28, 2017
Fully molded miniaturized semiconductor module
DECA TECHNOLOGIES INC29 citations94
US9177926B2Nov 3, 2015
Semiconductor device and method comprising thickened redistribution layers
DECA TECHNOLOGIES INC30 citations94
US8535978B2Sep 17, 2013
Die up fully molded fan-out wafer level packaging
DECA TECHNOLOGIES INC21 citations93
US9196509B2Nov 24, 2015
Semiconductor device and method of adaptive patterning for panelized packaging
DECA TECHNOLOGIES INC16 citations92
US10720417B2Jul 21, 2020
Thermally enhanced fully molded fan-out module
DECA TECHNOLOGIES INC11 citations86
US10373902B2Aug 6, 2019
Fully molded miniaturized semiconductor module
DECA TECHNOLOGIES INC14 citations86
US9761571B2Sep 12, 2017
Thermally enhanced fully molded fan-out module
DECA TECHNOLOGIES INC13 citations84
US9613912B2Apr 4, 2017
Method of marking a semiconductor package
DECA TECHNOLOGIES INC9 citations84
US9576919B2Feb 21, 2017
Semiconductor device and method comprising redistribution layers
DECA TECHNOLOGIES INC11 citations84
US9520331B2Dec 13, 2016
Adaptive patterning for panelized packaging
DECA TECHNOLOGIES INC5 citations84
US9418905B2Aug 16, 2016
Adaptive patterning for panelized packaging
DECA TECHNOLOGIES INC8 citations84
US9337086B2May 10, 2016
Die up fully molded fan-out wafer level packaging
DECA TECHNOLOGIES INC10 citations84
US9269622B2Feb 23, 2016
Semiconductor device and method of land grid array packaging with bussing lines
DECA TECHNOLOGIES INC9 citations84
US8922021B2Dec 30, 2014
Die up fully molded fan-out wafer level packaging
DECA TECHNOLOGIES INC12 citations84
US8826221B2Sep 2, 2014
Adaptive patterning for panelized packaging
DECA TECHNOLOGIES INC7 citations84
US10050004B2Aug 14, 2018
Fully molded peripheral package on package device
DECA TECHNOLOGIES INC8 citations83
US10818635B2Oct 27, 2020
Fully molded semiconductor package for power devices and method of making the same
DECA TECHNOLOGIES INC5 citations73
US10373913B2Aug 6, 2019
Method of marking a semiconductor package
DECA TECHNOLOGIES INC2 citations73
US9978655B2May 22, 2018
Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
DECA TECHNOLOGIES INC3 citations73
US9754835B2Sep 5, 2017
Semiconductor device and method comprising redistribution layers
DECA TECHNOLOGIES INC3 citations73
US9502397B1Nov 22, 2016
3D interconnect component for fully molded packages
DECA TECHNOLOGIES INC5 citations73
US9397069B2Jul 19, 2016
Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
DECA TECHNOLOGIES INC4 citations73
US9613830B2Apr 4, 2017
Fully molded peripheral package on package device
DECA TECHNOLOGIES INC2 citations72
AMKOR TECHNOLOGY INC
14 patentsUS7777351B1Aug 17, 2010
Thin stacked interposer package
AMKOR TECHNOLOGY INC413 citations99
US7342303B1Mar 11, 2008
Semiconductor device having RF shielding and method therefor
AMKOR TECHNOLOGY INC144 citations99
US7898066B1Mar 1, 2011
Semiconductor device having EMI shielding and method therefor
AMKOR TECHNOLOGY INC71 citations98
US7851894B1Dec 14, 2010
System and method for shielding of package on package (PoP) assemblies
AMKOR TECHNOLOGY INC114 citations98
US7745910B1Jun 29, 2010
Semiconductor device having RF shielding and method therefor
AMKOR TECHNOLOGY INC115 citations98
US7825520B1Nov 2, 2010
Stacked redistribution layer (RDL) die assembly package
AMKOR TECHNOLOGY INC102 citations96
US7550857B1Jun 23, 2009
Stacked redistribution layer (RDL) die assembly package
AMKOR TECHNOLOGY INC188 citations96
US7960827B1Jun 14, 2011
Thermal via heat spreader package and method
AMKOR TECHNOLOGY INC114 citations95
US7829990B1Nov 9, 2010
Stackable semiconductor package including laminate interposer
AMKOR TECHNOLOGY INC34 citations93
US7781852B1Aug 24, 2010
Membrane die attach circuit element package and method therefor
AMKOR TECHNOLOGY INC42 citations91
US7507603B1Mar 24, 2009
Etch singulated semiconductor package
AMKOR TECHNOLOGY INC40 citations91
US7859116B1Dec 28, 2010
Exposed metal bezel for use in sensor devices and method therefor
AMKOR TECHNOLOGY INC10 citations84
US7732899B1Jun 8, 2010
Etch singulated semiconductor package
AMKOR TECHNOLOGY INC11 citations83
US9768124B2Sep 19, 2017
Semiconductor package in package
AMKOR TECHNOLOGY INC4 citations73
SCANLAN CHRISTOPHER M
6 patentsUS8629546B1Jan 14, 2014
Stacked redistribution layer (RDL) die assembly package
SCANLAN CHRISTOPHER M41 citations98
US9466545B1Oct 11, 2016
Semiconductor package in package
SCANLAN CHRISTOPHER M29 citations94
US8796561B1Aug 5, 2014
Fan out build up substrate stackable package and method
SCANLAN CHRISTOPHER M38 citations94
US8799845B2Aug 5, 2014
Adaptive patterning for panelized packaging
SCANLAN CHRISTOPHER M24 citations92
US8604600B2Dec 10, 2013
Fully molded fan-out
SCANLAN CHRISTOPHER M17 citations92
US8203203B1Jun 19, 2012
Stacked redistribution layer (RDL) die assembly package
SCANLAN CHRISTOPHER M20 citations92
MOTOROLA INC
3 patentsBERRY CHRISTOPHER J
2 patentsShowing the top 50 of 59 patents by PatentIndex Score.