P

Inventor

OKAWA YUJI

JP12 patents
⚠️ This page may combine multiple inventors who share the name “OKAWA YUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NITTO DENKO CORP

7 patents
US6126772AOct 3, 2000

Method for resist removal, and adhesive or adhesive sheet for use in the same

NITTO DENKO CORP43 citations92
US5759874AJun 2, 1998

Method for producing semiconductor element and adhesive sheet for adhering wafer

NITTO DENKO CORP41 citations91
US7767556B2Aug 3, 2010

Adhesive sheet for laser dicing and its manufacturing method

NITTO DENKO CORP4 citations61
US7564119B2Jul 21, 2009

Adhesive sheet for laser dicing and its manufacturing method

NITTO DENKO CORP4 citations61
US7217638B2May 15, 2007

Wafer back surface treating method and dicing sheet adhering apparatus

NITTO DENKO CORP5 citations61
US7091499B2Aug 15, 2006

Ultraviolet irradiating method and an apparatus using the same

NITTO DENKO CORP4 citations61
US10858552B2Dec 8, 2020

Masking pressure-sensitive adhesive tape

NITTO DENKO CORP0 citations40

OGURA KAZUNARI

1 patent
US8827609B2Sep 9, 2014

Spindle device for machine tool

OGURA KAZUNARI6 citations65

NAKASHIMA KUNIMICHI

1 patent
US8740523B2Jun 3, 2014

Spindle device

NAKASHIMA KUNIMICHI5 citations65

JAPAN SCIENCE & TECH CORP

1 patent
US6656662B1Dec 2, 2003

Method of forming a polymer molecule chain

JAPAN SCIENCE & TECH CORP3 citations62

TAKASHIMA TOSHIHARU

1 patent
US8206068B2Jun 26, 2012

Main spindle device

TAKASHIMA TOSHIHARU2 citations55

JTEKT CORP

1 patent
US7997838B2Aug 16, 2011

Main spindle device

JTEKT CORP0 citations40