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Inventor
CHENG FENG-CHEN
TW
2 patents
Patents
2 patents
US7706149B2
Apr 27, 2010
Micro-electro-mechanical-system package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG
38 citations
90
US7839150B2
Nov 23, 2010
Detecting device for detecting electrical connection between pads of a package substrate
ADVANCED SEMICONDUCTOR ENG
3 citations
50