Inventor
CHEN KE-HUNG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “CHEN KE-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LIN MOU-SHIUNG
5 patentsUS8884433B2Nov 11, 2014
Circuitry component and method for forming the same
LIN MOU-SHIUNG23 citations92
US8399989B2Mar 19, 2013
Metal pad or metal bump over pad exposed by passivation layer
LIN MOU-SHIUNG20 citations92
US8558383B2Oct 15, 2013
Post passivation structure for a semiconductor device and packaging process for same
LIN MOU-SHIUNG16 citations84
US8148822B2Apr 3, 2012
Bonding pad on IC substrate and method for making the same
LIN MOU-SHIUNG12 citations84
US8304766B2Nov 6, 2012
Semiconductor chip with a bonding pad having contact and test areas
LIN MOU-SHIUNG5 citations72
MEGICA CORP
3 patentsUS7582556B2Sep 1, 2009
Circuitry component and method for forming the same
MEGICA CORP40 citations92
US7468545B2Dec 23, 2008
Post passivation structure for a semiconductor device and packaging process for same
MEGICA CORP40 citations92
US7947978B2May 24, 2011
Semiconductor chip with bond area
MEGICA CORP27 citations91