P

Inventor

LAISNE MICHAEL

US9 patents
⚠️ This page may combine multiple inventors who share the name “LAISNE MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

4 patents
US8384417B2Feb 26, 2013

Systems and methods utilizing redundancy in semiconductor chip interconnects

QUALCOMM INC28 citations88
US7750660B2Jul 6, 2010

Integrated circuit with improved test capability via reduced pin count

QUALCOMM INC6 citations68
US9024315B2May 5, 2015

Daisy chain connection for testing continuity in a semiconductor die

QUALCOMM INC5 citations66
US7932736B2Apr 26, 2011

Integrated circuit with improved test capability via reduced pin count

QUALCOMM INC1 citations47

LAISNE MICHAEL

2 patents
US8159255B2Apr 17, 2012

Methodologies and tool set for IDDQ verification, debugging and failure diagnosis

LAISNE MICHAEL4 citations49
US8420410B2Apr 16, 2013

Techniques providing fiducial markers for failure analysis

LAISNE MICHAEL1 citations44

ZUO SONGLIN

1 patent
US9316690B2Apr 19, 2016

Data recirculation in configured scan paths

ZUO SONGLIN7 citations74

DIALOG SEMICONDUCTOR UK LTD

1 patent
US11056210B1Jul 6, 2021

Electrical circuit comprising a trim circuit

DIALOG SEMICONDUCTOR UK LTD4 citations70

DIALOG SEMICONDUCTOR INC

1 patent
US10135686B2Nov 20, 2018

Communication interface

DIALOG SEMICONDUCTOR INC0 citations50