Inventor
LINN SCOTT A
US108 patents
⚠️ This page may combine multiple inventors who share the name “LINN SCOTT A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
44 patentsUS10875318B1Dec 29, 2020
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO31 citations97
US11034157B2Jun 15, 2021
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO29 citations94
US10894423B2Jan 19, 2021
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO29 citations94
US10022962B1Jul 17, 2018
Fluidic die
HEWLETT PACKARD DEVELOPMENT CO15 citations92
US11364719B2Jun 21, 2022
Print component with memory array using intermittent clock signal
HEWLETT PACKARD DEVELOPMENT CO7 citations86
US11331924B2May 17, 2022
Logic circuitry package
HEWLETT PACKARD DEVELOPMENT CO6 citations86
US11141973B2Oct 12, 2021
Integrated circuits including memory cells
HEWLETT PACKARD DEVELOPMENT CO4 citations84
US10940693B1Mar 9, 2021
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO3 citations84
US11780222B2Oct 10, 2023
Print component with memory circuit
HEWLETT PACKARD DEVELOPMENT CO1 citations73
US11667116B2Jun 6, 2023
Print component having fluidic actuating structures with different fluidic architectures
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11559985B2Jan 24, 2023
Integrated circuit with address drivers for fluidic die
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11491782B2Nov 8, 2022
Print component with memory circuit
HEWLETT PACKARD DEVELOPMENT CO1 citations73
US11479046B2Oct 25, 2022
Logic circuitry for sensor data communications
HEWLETT PACKARD DEVELOPMENT CO1 citations73
US11413862B2Aug 16, 2022
Print component having fluidic actuating structures with different fluidic architectures
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11413865B2Aug 16, 2022
Fluid ejection devices including contact pads
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11413864B2Aug 16, 2022
Die for a printhead
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11407218B2Aug 9, 2022
Identifying random bits in control data packets
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11250146B2Feb 15, 2022
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11068434B2Jul 20, 2021
Logic circuitry for a replicable print cartridge
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US10960658B2Mar 30, 2021
Detecting a level of printable fluid in a container
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US10926548B2Feb 23, 2021
Printing apparatus and methods for detecting fluid levels
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10589522B2Mar 17, 2020
Fluidic die
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10245830B2Apr 2, 2019
Printing system with a fluid circulating element
HEWLETT PACKARD DEVELOPMENT CO4 citations73
US10232610B2Mar 19, 2019
Fluidic die
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10124579B2Nov 13, 2018
Crack sensing for printhead having multiple printhead die
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10099475B2Oct 16, 2018
Piezoelectric printhead assembly with multiplier to scale multiple nozzles
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US9962949B2May 8, 2018
Printheads with sensor plate impedance measurement
HEWLETT PACKARD DEVELOPMENT CO3 citations72
US10308035B2Jun 4, 2019
Fluid level sensor and related methods
HEWLETT PACKARD DEVELOPMENT CO3 citations71
US9925787B2Mar 27, 2018
Fluid level sensor and related methods
HEWLETT PACKARD DEVELOPMENT CO2 citations71
US12403689B2Sep 2, 2025
Print component with memory array using intermittent clock signal
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US12350932B2Jul 8, 2025
Die for a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US12240231B2Mar 4, 2025
Integrated circuit with address drivers for fluidic die
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US12183430B2Dec 31, 2024
Communicating print component
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US12145360B2Nov 19, 2024
Integrated circuits including memory cells
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US12097695B2Sep 24, 2024
Accessing registers of fluid ejection devices
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US11969998B2Apr 30, 2024
Multiple circuits coupled to an interface
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US11969995B2Apr 30, 2024
Integrated circuits including memory cells
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US11938722B2Mar 26, 2024
Integrated circuits including memory cells
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US11912024B2Feb 27, 2024
Temperature detection and control
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US11760085B2Sep 19, 2023
Accessing registers of fluid ejection devices
HEWLETT PACKARD DEVELOPMENT CO1 citations63
US11731419B2Aug 22, 2023
Integrated circuits including customization bits
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US11701880B2Jul 18, 2023
Die for a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US11685153B2Jun 27, 2023
Communicating print component
HEWLETT PACKARD DEVELOPMENT CO0 citations63
US11676645B2Jun 13, 2023
Communicating print component
HEWLETT PACKARD DEVELOPMENT CO1 citations63
HEWLETT PACKARD DEVELOPMENT CO LP
2 patentsVAN BROCKLIN ANDREW L
2 patentsHEWLETT PACKARD CO
1 patentHEWLETT PACKARD CORP
1 patentShowing the top 50 of 108 patents by PatentIndex Score.