Inventor
KU HYUN MO
KR6 patents
⚠️ This page may combine multiple inventors who share the name “KU HYUN MO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AVAGO TECHNOLOGIES GENERAL IP
5 patentsUS9693445B2Jun 27, 2017
Printed circuit board with thermal via
AVAGO TECHNOLOGIES GENERAL IP7 citations82
US9972590B2May 15, 2018
Semiconductor package having a solder-on-pad structure
AVAGO TECHNOLOGIES GENERAL IP4 citations70
US9972592B2May 15, 2018
Bumped land grid array
AVAGO TECHNOLOGIES GENERAL IP0 citations49
US9974181B2May 15, 2018
Module with external shield and back-spill barrier for protecting contact pads
AVAGO TECHNOLOGIES GENERAL IP1 citations48
US9907169B1Feb 27, 2018
Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB
AVAGO TECHNOLOGIES GENERAL IP0 citations39