Inventor

LIN NAN-CHUN

TW57 patents

⚠️ This page may combine multiple inventors who share the name “LIN NAN-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN NAN-CHUN

POWERTECH TECHNOLOGY INC

Chip package structure with conductive pillar and a manufacturing method thereof

Package structure and manufacturing method thereof

Test method for a redistribution layer

Package structure having a first connection circuit and manufacturing method thereof

Packaging structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Chip package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure including at least one connecting module and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure and manufacturing method thereof

Manufacturing method of package structure

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

Manufacturing method of package structure

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure and manufacturing method thereof

Chip package structure using silicon interposer as interconnection bridge

Manufacturing method of chip package structure comprising encapsulant having concave surface

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

Fan-out semiconductor package and method for manufacturing the same

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package comprising plurality of bumps and fabricating method

Package structure including multiple dies surrounded by conductive element and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package with conductive via in encapsulation connecting to conductive element

Semiconductor package structure with circuit substrate and manufacturing method thereof

Package structure and method of manufacturing the same

Method thereof of package structure

Testing method of packaging process and packaging structure

TSAI CHIA-LUN

Electronic device package and method for fabricating the same

LIN NAN-CHUN

Three-dimensional system-in-package package-on-package structure

INNOLUX CORP

Display device

CARUX TECH PTE LTD

Electronic device and vehicle system

CHEN WEN-CHUAN

Injection molding system and method of chip package

APTOS TECHNOLOGY INC

Optoelectronic package and method of manufacturing the same