Inventor
YANG CHEN-TSAI
TW8 patents
Patents
8 patentsUS10384434B2Aug 20, 2019
Separating device and separating method
IND TECH RES INST3 citations69
US10757804B1Aug 25, 2020
Flexible hybrid electronic system and method of reducing the impact thereof
IND TECH RES INST2 citations67
US11362045B2Jun 14, 2022
Chip package structure
IND TECH RES INST0 citations55
US11646259B2May 9, 2023
Redistribution structure and forming method thereof
IND TECH RES INST0 citations47
US12232256B2Feb 18, 2025
Flexible hybrid electronic substrate and electronic textile including the same
IND TECH RES INST0 citations44
US10622326B2Apr 14, 2020
Chip package structure
IND TECH RES INST0 citations36
US10461035B2Oct 29, 2019
Semiconductor package structure
IND TECH RES INST0 citations36
US10249567B2Apr 2, 2019
Redistribution layer structure of semiconductor package
IND TECH RES INST0 citations36