Inventor

ICHIMURA SHIGEKI

JP7 patents

⚠️ This page may combine multiple inventors who share the name “ICHIMURA SHIGEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

3 patents

US6236108B1May 22, 2001

Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package

HITACHI CHEMICAL CO LTD24 citations92

US5319005AJun 7, 1994

Epoxy resin molding material for sealing of electronic component

HITACHI CHEMICAL CO LTD32 citations92

US6331729B1Dec 18, 2001

Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them

HITACHI CHEMICAL CO LTD10 citations73

NHK SPRING CO LTD

2 patents

US6331576B1Dec 18, 2001

Surface-decorated foam skin of cross-linked rubbery soft olefin resin

NHK SPRING CO LTD2 citations60

US11001690B2May 11, 2021

Cushion material, seat cushion material, and seat

NHK SPRING CO LTD0 citations44

HITACHI COMPANY LTD

1 patent

US6064111AMay 16, 2000

Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package

HITACHI COMPANY LTD84 citations93

MITSUI CHEMICALS INC

1 patent

US5972492AOct 26, 1999

Foamed pad material for low-pressure compression molding

MITSUI CHEMICALS INC15 citations70