Inventor

HUANG LI-HSIEN

TW111 patents

⚠️ This page may combine multiple inventors who share the name “HUANG LI-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG LI-HSIEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Chip package structure with bump and method for forming the same

Devices employing thermal and mechanical enhanced layers and methods of forming same

Integrated fan-out packages and methods of forming the same

Package with UBM and methods of forming

Package structure with dummy die

Chip package structure with molding layer and method for forming the same

Pop devices and methods of forming the same

Chip package structure with bump

Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices

Alignment mark design for packages

Package structure, die and method of manufacturing the same

Method for dicing integrated fan-out packages without seal rings

Device and package structure and method of forming the same

Chip package structure with bump

Devices employing thermal and mechanical enhanced layers and methods of forming same

Chip package structure with molding layer

Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same

Package structure and manufacturing method thereof

Package structure with dummy die

Stacked semiconductor devices and methods of forming same

Multi-stack package-on-package structures

Device, package structure and method of forming the same

Devices employing thermal and mechanical enhanced layers and methods of forming same

Semiconductor package and forming method thereof

Multi-stack package-on-package structures

Devices employing thermal and mechanical enhanced layers and methods of forming same

Semiconductor package and method of manufacturing the same

Stacked semiconductor devices and methods of forming same

Redistribution structure for integrated circuit package and method of forming same

Chip package and method of fabricating the same

Chip package structure with bump

Redistribution layers in semiconductor packages and methods of forming same

Semiconductor package and method

Redistribution lines having stacking vias

Device and package structure

Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same

Package with UBM and methods of forming

Package structure and method of forming the same

Semiconductor package and method

Alignment mark design for packages

Redistribution layers in semiconductor packages and methods of forming same

PoP device and method of forming the same

Package structures and methods of forming the same

Alignment mark design for packages

Package structure including IPD and method of forming the same

Air channel formation in packaging process

Semiconductor package and method of manufacturing the same

Semiconductor device and manufacturing method thereof

CHEN SHUO-MAO

Package with passive devices and method of forming the same

YU CHEN-HUA

Through-silicon vias for semicondcutor substrate and method of manufacture