Inventor
HWEE TAN KIM
SG6 patents
⚠️ This page may combine multiple inventors who share the name “HWEE TAN KIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANPACK SOLUTIONS PTE LTD
5 patentsUS6510976B2Jan 28, 2003
Method for forming a flip chip semiconductor package
ADVANPACK SOLUTIONS PTE LTD75 citations95
US7456496B2Nov 25, 2008
Package design and method of manufacture for chip grid array
ADVANPACK SOLUTIONS PTE LTD48 citations92
US6750082B2Jun 15, 2004
Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip
ADVANPACK SOLUTIONS PTE LTD45 citations91
US6929981B2Aug 16, 2005
Package design and method of manufacture for chip grid array
ADVANPACK SOLUTIONS PTE LTD26 citations89
US6734039B2May 11, 2004
Semiconductor chip grid array package design and method of manufacture
ADVANPACK SOLUTIONS PTE LTD28 citations89