Inventor

HO KWOK KEUNG PAUL

HK18 patents

⚠️ This page may combine multiple inventors who share the name “HO KWOK KEUNG PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HO KWOK KEUNG PAUL

CHARTERED SEMICONDUCTOR MFG

Method to avoid copper contamination on the sidewall of a via or a dual damascene structure

Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding

Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding

Plasma etch method for forming plasma etched silicon layer

Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding

Method of application of copper solution in flip-chip, COB, and micrometal bonding

Method and cleaner composition for stripping copper containing residue layers

Plasma etch method for forming plasma etched silicon layer

NANO & ADVANCED MATERIALS INST LTD

High voltage electrolyte and lithium ion battery

Impact protection material and method of making the same

Flexible electric generator for generating electric power

Method and hardware to enhance light out-coupling

Direct texture transparent conductive oxide served as electrode or intermediate layer for photovoltaic and display applications

Thermally conductive composites and method of preparing same

Fullerene derivatives and their applications in organic photovoltaics

MIND TECH DEVELOPMENT LIMITED

Sensing film with an integrated structure

Flexible transparent thin film

CHARTERED SEMICONDUCOTOR MANUF

Method and cleaner composition for stripping copper containing residue layers