Inventor

HOU YUANKUN

CN2 patents

⚠️ This page may combine multiple inventors who share the name “HOU YUANKUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMICONDUCTOR MFG INT SHANGHAI CORP

1 patent

US9653312B2May 16, 2017

Sealing structure for a bonded wafer and method of forming the sealing structure

SEMICONDUCTOR MFG INT SHANGHAI CORP2 citations64

SEMICONDUCTOR MFG INTERNATIONAL (SHANGHAI) CORPORATION

1 patent

US9837287B2Dec 5, 2017

Sealing structure for a bonded wafer and method of forming the sealing structure

SEMICONDUCTOR MFG INTERNATIONAL (SHANGHAI) CORPORATION0 citations43